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| DIODE FEATURES Type : 10EDB60 1A 600V Tj =150 C OUTLINE DRAWING * Miniature Size * Low Forward Voltage drop * Low Reverse Leakage Current * High Surge Capability * 26mm and 52mm Inside Tape Spacing Package Available Maximum Ratings Rating Repetitive Peak Reverse Voltage Average Rectified Output Current RMS Forward Current Surge Forward Current Operating JunctionTemperature Range Storage Temperature Range Symbol VRRM IO IF(RMS) IFSM Tjw Tstg Approx Net Weight:0.17g 10EDB60 600 50Hz Half Sine Wave Resistive Load Ta=39C *1 Ta=26C *2 1.0 0.9 1.57 50Hz Half Sine Wave,1cycle, Non-repetitive - 40 to + 150 - 40 to + 150 45 Unit V A A A C C Electrical * Thermal Characteristics Characteristics Peak Reverse Current Peak Forward Voltage Symbol IRM VFM Conditions Min. Typ. Max. 10 1.0 110 140 Unit A V C/W Tj= 25C, VRM= VRRM Tj= 25C, IFM= 1.0A Junction to P.C. Board mounted*1 Thermal Resistance Rth(j-a) Ambient Without Fin *2 *1: P.C. Board mounted (L=3mm, Print Land=5 x 5mm, Both Sides) *2: Without Fin or P.C. Board mounted 10EDB OUTLINE DRAWING (Dmensions in mm) FORWARD CURRENT VS. VOLTAGE 10 10EDB60 INSTANTANEOUS FORWARD CURRENT (A) 5 2 Tj=25C Tj=150C 1 0.5 0.2 0.1 0 0.4 0.8 1.2 1.6 INSTANTANEOUS FORWARD VOLTAGE (V) AVERAGE FORWARD POWER DISSIPATION 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 HALF SINE WAVE 10EDB60 D.C. AVERAGE FORWARD POWER DISSIPATION (W) 0 0.4 0.8 1.2 1.6 AVERAGE FORWARD CURRENT (A) AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE Without Fin or P.C. Board 1.4 10EDB60 AVERAGE FORWARD CURRENT (A) 1.2 D.C. 1.0 HALF SINE WAVE 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (C) AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE P.C. Board mounted (L=3mm,Print Land=5x5mm,Both Sides)) 1.6 D.C. 10EDB60 AVERAGE FORWARD CURRENT (A) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 HALF SINE WAVE 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (C) SURGE CURRENT RATINGS f=50Hz,Harf Sine Wave,Non-Repetitive,No Load 50 10EDB60 SURGE FORWARD CURRENT (A) 40 30 20 10 I FSM 0.02s 0 0.02 0.05 0.1 0.2 0.5 1 2 TIME (s) |
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